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Forest loss forces langur species to interbreed, study shows

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Forest loss forces langur species to interbreed, study shows


Forest loss forces langur species to interbreed
A juvenile hybrid langur in Rema-Kalenga Wildlife Sanctuary, Bangladesh. One can easily recognized the mixture of morphological characters. For examplethe white eye rings of the Phayre’s langurs and the golden-brown breast hair of the capped langurs. Credit: Auritro Sattar, Deutsches Primatenzentrum GmbH

Research shows a threatening development for two endangered primate species in Bangladesh: Phayre’s langurs (Trachypithecus phayrei) and capped langurs (Trachypithecus pileatus). In mixed groups of these two species, hybrids have been found and genetically confirmed. If hybridization continues, it could mean the extinction of one or both species.

The paper is published in the International Journal of Primatology.

Over five years (2018–2023), an international team of researchers led by Tanvir Ahmed, a Ph.D. student at the German Primate Center, studied the langur populations in north-eastern Bangladesh. They found that 8 of the 98 langur studied groups consisted of Phayre’s and capped langurs, and in three groups, some individuals appeared as a mixture of the two species.

Later, researchers analyzed genetic samples of the species in the lab of the German Primate Center, and confirmed one case of hybridization. This langur had a capped langur mother and a Phayre’s langur father. Another female with a hybrid appearance showed signs of motherhood, indicating that at least female hybrids are fertile and give birth to young.

Hybridization is generally rare among primates but occurs in areas where the distribution ranges of related species overlap. Human activities such as deforestation, habitat fragmentation, hunting and trapping of primates, leading to a thinning of populations and restricting the movements of individuals between local populations, can increase the risk of such hybridization.

Ahmed, lead author of the study, says, “The existence of fertile hybrids is particularly alarming because it suggests that gene flow between these two endangered species could irreversibly affect their future genetic composition.”

Christian Roos, senior author of the study, emphasizes the global relevance of the research results, “This is not just a local problem. When habitats are destroyed, animals mix unnaturally and form mixed groups and hybridization might occur. This can even mean the extinction of one or both species.”

Urgent need for action: Forest protection and research as the key to conservation strategies

The study also showed that well-protected forests have a higher population density of langurs compared to less protected ones. However, these forests are often too small, too isolated and fragmented to ensure the long-term survival of the species.

“Forest conservation must become a national priority. If we don’t act now, we risk losing not only two monkey species but also an important part of Bangladesh’s biodiversity,” says Ahmed.

In addition to forest protection, ongoing research is needed to better understand the effects of hybridization and to develop suitable conservation strategies.

Dietmar Zinner, co-author of the study, summarizes, “This study is a wake-up call. We need more data to develop effective long-term conservation strategies. Further research will help us understand the extent of hybridization, the impact of human activities and how to prevent its worst effects.”

With fewer than 500 Phayre’s langurs and 600 capped langurs in north-east Bangladesh, time is running out for these species. Their survival depends on immediate action, including both forest conservation and creating dispersal corridors for the species between the forests.

As part of his doctoral project, which is supported by the German Primate Center and the German Academic Exchange Service (DAAD), researcher Ahmed is now focusing on a large-scale genetic study of langur populations and their vulnerability to climate change. The findings should contribute to an adapted action plan for the protection of langurs in Bangladesh.

More information:
Tanvir Ahmed et al, Mixed-Species Groups and Genetically Confirmed Hybridization Between Sympatric Phayre’s Langur (Trachypithecus phayrei) and Capped Langur (T. pileatus) in Northeast Bangladesh, International Journal of Primatology (2024). DOI: 10.1007/s10764-024-00459-x

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Leibniz Institute for Primate Research

Citation:
Forest loss forces langur species to interbreed, study shows (2024, September 27)
retrieved 27 September 2024
from https://phys.org/news/2024-09-forest-loss-langur-species-interbreed.html

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Shape-morphing brain sensor adheres to curved surfaces for ultrasound neurostimulation

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Shape-morphing brain sensor adheres to curved surfaces for ultrasound neurostimulation


A brain-adhesive and shape-morphing sensor for transcranial ultrasound neurostimulation
Our brain sensor adheres strongly to the surface of brain tissue. In the case of a rat brain (as shown in the bottom-left photo), the sensor remains securely attached even when pulled with force, demonstrating its robustness. Similarly, the top and bottom-right images show successful and firm adhesion to bovine brain tissue, further proving its potential for application in large animal studies and clinical research. Credit: Professor Donghee Son.

Transcranial focused ultrasound, a non-invasive technique to stimulate specific areas of the brain using high-frequency sound waves, could be a promising treatment strategy for many neurological disorders. Most notably, it could help to treat drug-resistant epilepsy and other conditions associated with recurrent tremors.

Researchers at Sungkyunkwan University (SKKU), the Institute for Basic Science (IBS) and the Korea Institute of Science and Technology recently developed a new sensor that could be used to perform transcranial focused ultrasound on patients. This sensor, introduced in a paper published in Nature Electronics, adapts its shape and can closely adhere to cortical surfaces, allowing users to record neural signals and stimulate specific brain regions via low intensity ultrasound waves.

“Previous research on brain sensors that contact the brain surface struggled with accurately measuring brain signals due to the inability to conform tightly to the brain’s complex folds,” Donghee Son, supervising author for the study, told Tech Xplore.

“This limitation made it difficult to precisely analyze the entire brain surface and accurately diagnose brain lesions. While a brain sensor previously developed by Professor John A. Rogers and Professor Dae-Hyeong Kim addressed this issue to some extent due to its extremely thin form, it still faced challenges in achieving tight adhesion in regions with severe curvature.”

The sensor previously developed by Professors Rogers and Kim was found to collect more precise measurements on the brain’s surface. Despite its promise, this sensor presented various limitations, such as failing to adhere to surfaces of the brain that had a larger curvature, as well as the proneness to slipping from its original attachment point due to micro-motions in the brain and the flow of cerebral spinal fluid (CSF).

These observed challenges limit its potential use in medical settings, as they reduce its ability to consistently measure brain signals in target regions for prolonged periods of time. As part of their study, Son and his colleagues set out to develop a new sensor that could overcome these limitations, adhering well to curved brain surfaces and thus enabling the reliable collection of measurements for extended time periods.

“The new sensor we developed can tightly conform to highly curved brain regions and adhere firmly to the brain tissue,” said Son. “This strong adhesion allows for long-term and precise measurement of brain signals from targeted areas.”

The sensor developed by Son and his colleagues, dubbed ECoG, adheres securely to brain tissue without forming any voids. This can significantly reduce the noise originating from external mechanical movements.

“This characteristic is particularly important in enhancing the effectiveness of epilepsy treatment through low-intensity focused ultrasound (LIFU),” said Son. “While it is well-known that the ultrasound can help minimize epileptic activity, the variability in patient conditions and the differences between individuals have posed significant challenges for tailoring treatments to each patient.”

In recent years, many research groups have been trying to devise personalized ultrasound stimulation treatments for epilepsy and other neurological disorders. To shape treatments based on the needs of individual patients, however, they should be able to measure the patient’s brain waves in real-time while stimulating specific brain regions.

A brain-adhesive and shape-morphing sensor for transcranial ultrasound neurostimulation
Our brain sensor (SMCA) begins to form a strong bond at the contact surface immediately upon attachment to the brain tissue. Over time, it gradually conforms to the brain’s contours, ultimately achieving complete brain tissue interfacing without any voids. Credit: Donghee Son.

“Conventional brain surface-attached sensors struggled with this because the ultrasound-induced vibrations caused significant noise, making it difficult to monitor brain waves in real-time,” said Son.

“This limitation was a major obstacle in creating personalized treatment strategies. Our sensor drastically reduces noise, enabling successful treatment of epilepsy through personalized ultrasound stimulation.”

The shape-morphing and cortex-adhesive brain sensor developed by Son and his colleagues comprises three main layers. These include a hydrogel-based layer that can bond with tissue both physically and chemically, a self-healing polymer-based layer that can change its shape to match the shape of the surface below it, and a stretchable, ultrathin layer containing gold electrodes and interconnects.

“When the sensor is applied to the brain surface, the hydrogel layer undergoes a gelation process, initiating an instant, strong attachment to the brain tissue,” explained Son.

“Following this, the self-healing polymer substrate begins to deform, conforming to the brain’s curvature, increasing the contact area between the sensor and the tissue over time. Once the sensor has fully adhered to the contours of the brain, it is ready to operate.”

The sensor developed by this research team has several advantages over other brain sensors introduced in recent years. Firstly, it can attach to brain tissue securely while also adapting its shape to fit tightly onto brain surfaces, irrespective of their level of curvature.

By adapting to the shape of curved surfaces, the sensor minimizes the vibrations produced by external ultrasound simulation. This could allow doctors to precisely measure the waves in their patients’ brains both under normal conditions and during ultrasound simulation.

“We expect this technology will not only be applicable in epilepsy treatment but also in diagnosing and treating various brain disorders,” said Son. “The most critical aspect of our work is the combination of a tissue-adhesive technology that enables the sensor to adhere firmly to the surface of brain tissue and a shape-morphing technology that allows it to conform to the brain’s contours without creating voids.”

So far, the new sensor developed by Son and his colleagues has been tested on living and awake rodents. The findings collected were highly promising, as the team was able to precisely measure brain waves and control seizures in the animals.

The researchers eventually plan to scale the sensor, building on their design to create a high-density array. After it passes clinical trials, this upgraded sensor could diagnose and treat epilepsy or other neurological disorders while potentially paving the way for more effective prosthetic technologies.

“Our brain sensor is currently equipped with 16 electrode channels, which presents an area for improvement in terms of high-resolution brain signal mapping,” added Son.

“With this in mind, we plan to significantly increase the number of electrodes to enable more detailed and high-resolution brain signal analysis. Additionally, we aim to develop a minimally invasive method to implant the brain sensor on the surface of the brain, with the ultimate goal of applying it in clinical research.”

More information:
Sungjun Lee et al, A shape-morphing cortex-adhesive sensor for closed-loop transcranial ultrasound neurostimulation, Nature Electronics (2024). DOI: 10.1038/s41928-024-01240-x

© 2024 Science X Network

Citation:
Shape-morphing brain sensor adheres to curved surfaces for ultrasound neurostimulation (2024, September 27)
retrieved 27 September 2024
from https://techxplore.com/news/2024-09-morphing-brain-sensor-adheres-surfaces.html

This document is subject to copyright. Apart from any fair dealing for the purpose of private study or research, no
part may be reproduced without the written permission. The content is provided for information purposes only.





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Smashing heavy ions together could produce the world’s strongest electric fields

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Smashing heavy ions together could produce the world’s strongest electric fields


Smashing heavy ions together could produce the world's strongest electric fields
Experiments are underway to recreate the conditions at the heart of neutron stars, such as this one discovered by NASA’s Chandra X-ray Observatory and the European Southern Observatory’s Very Large Telescope in Chile. Credit: X-ray (NASA/CXC/ESO/F.Vogt et al); Optical (ESO/VLT/MUSE & NASA/STScI)

Lab experiments around the globe that are gearing up to recreate the mysterious phase of matter found in the early universe could also produce the world’s strongest electromagnetic fields, according to a theoretical analysis by a RIKEN physicist and two colleagues. This unanticipated bonus could enable physicists to investigate entirely new phenomena.

According to the Standard Model of particle physics, when extremely hot matter is squashed down into an ultradense object, it will form a plasma made up of subatomic particles known as quarks and gluons. But experiments are needed to confirm whether this is the case.

“Although such expectations exist, there are huge theoretical uncertainties, especially at ultrahigh densities,” notes Hidetoshi Taya of the RIKEN Interdisciplinary Theoretical and Mathematical Sciences Program. “Thus, experiments are greatly needed to study this extreme form of matter.”

In these experiments, physicists collide heavy ions (charged atoms) together and then examine the plasma created.

In previous decades, such tests mostly used high energies to create high temperatures. Recently, however, several experiments around the globe have been shifting focus to intermediate energies that will create high-density plasmas.

“This is crucially important to understand our origin, since such extreme conditions are realized in the early universe, neutron stars and exploding stars called supernovae,” explains Taya.

Taya had already studied intense lasers and the strong electromagnetic fields they produce. He realized that similar—but much stronger—fields may be created as an unexpected byproduct of these collision experiments. This possibility is tantalizing because physicists suspect that such ultrastrong fields will create novel physics phenomena.

But until now, physicists hadn’t been able to generate fields anywhere near strong enough to check this possibility.

“An intense laser is equivalent to roughly a hundred trillion LEDs,” says Taya. “But even these lasers are weak compared to the fields needed to produce these new strong-field physics effects.”

Taya and his colleagues have now conducted a theoretical analysis of these ultrastrong fields. The study is published in the journal Physical Review C.

“We’ve demonstrated that electric fields, which are strong and long-lived enough to explore strong-field physics—that cannot be approached with any other experiments—can be produced in heavy-ion collisions of intermediate energy,” says Taya.

However, physicists won’t be able to directly measure the produced field and thus confirm Taya’s analysis in planned collision experiments—they will only be able to measure the particles produced by the collision and their properties.

“To really test our prediction, it’s crucial to understand how the strong electromagnetic fields affect the observable particles,” says Taya. “We’re currently working on this.”

More information:
Hidetoshi Taya et al, Estimation of electric field in intermediate-energy heavy-ion collisions, Physical Review C (2024). DOI: 10.1103/PhysRevC.110.014901

Citation:
Smashing heavy ions together could produce the world’s strongest electric fields (2024, September 27)
retrieved 27 September 2024
from https://phys.org/news/2024-09-heavy-ions-world-strongest-electric.html

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Amazon’s $4 billion partnership with AI startup Anthropic gets UK competition clearance

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Amazon’s  billion partnership with AI startup Anthropic gets UK competition clearance


amazon
Credit: Unsplash/CC0 Public Domain

Britain’s competition watchdog said Friday that it’s clearing Amazon’s partnership with artificial intelligence company Anthropic because the $4 billion deal didn’t qualify for further scrutiny.

The Competition and Markets Authority approval comes after it started looking into the deal, part of wider global scrutiny for the wave of investment from Big Tech companies into leading startups working on generative AI technology.

The watchdog found that San Francisco-based Anthropic’s revenue and its combined market share with Amazon in Britain were not big enough to require an in-depth investigation under the country’s merger rules.

“We welcome the UK’s Competition and Markets Authority decision acknowledging its lack of jurisdiction regarding this collaboration,” Amazon said in a statement. “By investing in Anthropic, we’re helping to spur entry and competition in generative AI.”

Under the deal, Anthropic is using Amazon Web Services as its primary cloud provider and Amazon’s custom chips to build, train and deploy its AI models.

The British regulator has previously cleared Microsoft’s partnership with French startup Mistral AI as well as its hiring of key staff from another startup, Inflection AI.

The watchdog is still scrutinizing a partnership between Anthropic and Google. Anthropic was founded in 2021 by siblings Dario and Daniela Amodei, who previously worked at ChatGPT maker OpenAI. The company has focused heavily on increasing the safety and reliability of AI models.

The AI deals are also facing scrutiny across the Atlantic, where the Federal Trade Commission is looking into whether they’re helping tech giants gain an unfair advantage in the booming market for AI services.

© 2024 The Associated Press. All rights reserved. This material may not be published, broadcast, rewritten or redistributed without permission.

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Amazon’s $4 billion partnership with AI startup Anthropic gets UK competition clearance (2024, September 27)
retrieved 27 September 2024
from https://techxplore.com/news/2024-09-amazon-billion-partnership-ai-startup.html

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Overcoming the challenges of processing silicon carbide single crystals

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Overcoming the challenges of processing silicon carbide single crystals


Spotlight on ultra-precision machining: Overcoming the challenges of processing silicon carbide single crystals
Device level SiC wafers require a systematic process including single crystal growth, wire cutting, lapping or grinding, and chemical mechanical polishing. SiC wafers have important application value in fields such as satellite communication, microwave radar, 5G, electric vehicles, etc. Credit: Journal of Advanced Manufacturing Science and Technology, Tsinghua University Press

Silicon carbide (SiC) has emerged as a crucial material in the realm of high-end electronics, particularly for applications requiring high thermal conductivity, high hardness, and robust chemical stability. Its application extends to power electronics, high-temperature semiconductors, and cutting-edge devices.

However, the processing of SiC substrates presents significant challenges, including the need for precision grinding methods that minimize surface roughness and subsurface damage while managing high processing costs. These challenges have spurred ongoing research to refine grinding techniques and understand the atomic-level damage mechanisms involved in processing SiC.

Despite numerous studies on SiC processing, a comprehensive understanding of the latest advancements and their implications for improving manufacturing efficiency remains fragmented. Recent efforts have focused on addressing these gaps by investigating new processing methods and materials to better control the surface and subsurface characteristics of SiC wafers.

Recently, a team of mechanical scientists led by Shang Gao from Dalian University of Technology, China published a review paper providing a thorough overview of the state-of-the-art in SiC processing. They systematically reviewed the current processing flows for SiC wafers, material removal mechanisms, and processing technologies, and provided guidance on future directions for SiC wafer processing.

The team published their work in the Journal of Advanced Manufacturing Science and Technology.

“This review provides a thorough analysis of the state-of-the-art methods for SiC processing and identifies key areas where further research is necessary,” said Shang Gao, the corresponding author. “By consolidating current knowledge and outlining future research directions, this work aims to guide the development of more efficient and effective processing techniques for SiC wafers.”

The article covers various aspects of SiC processing, including different grinding, lapping, and polishing techniques employed in the field. It delves into the mechanisms underlying material removal and highlights the latest technological advancements. The paper also addresses the challenges faced in achieving high-quality SiC wafers and proposes several innovative approaches to overcome these obstacles.

Through a comprehensive analysis, the review identifies critical areas requiring further investigation, providing a roadmap for future research efforts.

“This comprehensive review serves as a valuable resource for researchers and practitioners in the field, offering a detailed understanding of the current state of SiC processing and highlighting the critical areas that need further investigation,” Shang Gao added. “Our work aims to push the boundaries of what is currently known and stimulate further advancements in the field.”

More information:
Haoxiang WANG et al, Ultraprecision machining for single-crystal silicon carbide wafers: State-of-the-art and prospectives, Journal of Advanced Manufacturing Science and Technology (2024). DOI: 10.51393/j.jamst.2025010

Provided by
Tsinghua University Press

Citation:
Spotlight on ultra-precision machining: Overcoming the challenges of processing silicon carbide single crystals (2024, September 27)
retrieved 27 September 2024
from https://techxplore.com/news/2024-09-spotlight-ultra-precision-machining-silicon.html

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